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YL-SP series thermal gasket
The L-SP series thermal gasket is a conventional performance gap filling thermal conductivity material, mainly used for electronic devices and heat sinks or product housing transfer interface. Low interfacial thermal resistance can be achieved at relatively low pressures. Applied between the power device and the cooling aluminum sheet or the machine shell, the air can be effectively excluded to achieve a good filling effect. Application industry different products correspond to different product specifications, products can be customized according to customer needs.
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Procurement information
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Thermal two-component gel is a two-component liquid gap thermal conductive filling material, which can be cured at room temperature or high temperatur…
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Kunshan Yuling Thermal Conductivity Technology Co., Ltd
Contact person: Mr. Chen: 18913288122
Miss Chen: 13776316891
Mr. Dai:13584929060
telephone：0512-55197362
facsimile：0512-55197350
mailbox：chenk@ksyuling.com.cn
Address: No. 245 Lushijing Road, Penglang Development Zone, Kunshan City
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