1. Thermal conductivity adhesive has excellent thermal conductivity (heat dissipation performance), and the thermal conductivity after curing [W/(m·k)] reaches 1.1~1.5, which provides a high and stable heat dissipation coefficient for electronic products, and plays a positive role in the stability of electronic products (especially those requiring high heat dissipation products) in the process of use, improving the service performance and life of products;
2. Thermal conductive adhesive has good electrical properties, aging resistance, cold and heat resistance, moisture resistance, non-swelling, electrical insulation, power decay rate, shock resistance, water resistance, vibration absorption and stability, which increases the safety factor of electronic products in the use process;
3. Thermal conductivity adhesive has good bonding strength, especially for electronic components, aluminum, PVC, PBT and other plastics with good adhesion, while playing both excellent sealing, but also has excellent bonding and thermal conductivity;
4 Heat conductive adhesive. Curing speed is fast, easy to extrude, but not flowing, easy to operate, can be manually sizing or mechanical sizing, no leakage, to meet any working environment and working conditions, with simple and convenient sizing benefits;
5. Thermal conductivity adhesive is a non-toxic, non-irritating gas release, solvent-free, non-corrosive, pollution-free, safer and more environmentally friendly, has passed the EU RoHS standard, while allowing operating personnel and consumers using electronic products to rest assured, providing a double guarantee for safety and environmental protection;
6. Thermal conductivity adhesive has excellent high and low temperature resistance, short-term high temperature resistance of 300 degrees, long-term high temperature resistance of 280 degrees, low temperature resistance of -60 degrees;
